Intel, UMC Announce New Foundry Alliance

Intel Corp. and United Microelectronics Corporation announced that they will collaborate on the development of a 12nm semiconductor process platform. Particularly, to address high-growth markets such as mobile, communication infrastructure, and networking.

Accordingly, the agreement brings together Intel’s at-scale U.S. manufacturing capacity and UMC’s extensive foundry experience on mature nodes. Thus, enabling an expanded process portfolio.

Moreover, it also offers global customers greater choice in their sourcing decisions with access to a more geographically diversified and resilient supply chain.

Intel Corp. and United Microelectronics Corp. announce that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets. (Credit: Intel Corporation)

Capitalize Each Other’s Strength

Stuart Pann, Intel senior vice president and general manager of Intel Foundry Services (IFS), said, “Taiwan has been a critical part of the Asian and global semiconductor and broader technology ecosystem for decades. Intel is committed to collaborating with innovative companies in Taiwan, such as UMC, to help better serve global customers.”

In addition, Pann said, “Intel’s strategic collaboration with UMC further demonstrates our commitment to delivering technology and manufacturing innovation across the global semiconductor supply chain. (In addition,) it also another important step toward our goal of becoming the world’s second-largest foundry by 2030.”

Meanwhile, Jason Wang, UMC co-president, said the collaboration is a step forward in advancing the company’s strategy for cost-efficient capacity expansion. Moreover, harnessing technology node advancement.

In addition, Wang said, “This effort will enable our customers to smoothly migrate to this critical new node. (It will) also benefit from the resiliency of an added Western footprint.”

Utilize Intel’s U.S. Manufacturing Strength

The 12nm node will utilize Intel’s U.S. based high-volume manufacturing capacity and experience in FinFET transistor design. Thus, offering a strong combination of maturity, performance, and power efficiency. The production will benefit from UMC’s decades of process leadership. Also, harnesses history of providing customers with Process Design Kit (PDK) and design assistance for effectively providing foundry services.

The new process node will be developed and manufactured in Fabs 12, 22, and 32 at Intel’s Ocotillo Technology Fabrication site in Arizona. Leveraging existing equipment in these fabs will significantly reduce upfront investment requirements and optimize utilization.

Moreover, the two companies will work to satisfy customer demand and cooperate on design enablement to support the 12nm process. Thus, enabling electronic design automation and intellectual properties solutions from ecosystem partners. Production of the 12nm process will likely commence in 2027. Intel has been investing and innovating in the U.S. and globally for more than 55 years, with established or planned manufacturing sites and investments in Oregon, Arizona, New Mexico and Ohio, in addition to Ireland, Germany, Poland, Israel and Malaysia. IFS has made significant progress over the past year, building strong momentum with new customers, including new customers across the Intel 16, Intel 3 and Intel 18A process technologies.