Kioxia Corporation, a leader in memory solutions, and MoDeCH Inc., a leading developer of modeling and design technology, have jointly developed an industry-first three-dimensional (3D) probing system. Specifically, the new system is for the high-frequency characteristic measurement for 3D objects up to 110GHz. This time, the new system was announced at The European Microwave Conference (EuMC) on September 26⁽¹⁾.

Conventionally, solid-state drives (SSDs) in data centers are inserted into high-speed interface connectors on the processor motherboards. In this situation, transmission lines for high-speed interfaces such as PCIe® adopt a 3D structure. Specifically, it extends from the motherboards of the processor to the printed circuit boards (PCBs) in the SSDs via orthogonal card-edge connectors (Figure 1). Typically, high-frequency characteristics of such 3D structures are evaluated by simulations. Now, with the newly developed 3D probing system, it becomes possible to directly measure characteristics of 3D structures up to 110GHz.

Mainly, Kioxia and MoDeCH developed a 3D probe station to measure high-frequency characteristics of the 3D structure (Figure 2). Primarily, the station incorporates a built-in mechanism that rotates high-frequency probes and frequency extenders together. Accordingly, this makes contact with a 3D structure possible to measure it.

In addition, the companies developed thru standards for individual 3D structures (Figure 3) for accurate measurement of high-frequency characteristics. Also, to evaluate a vertically bent 3D structure, a thru was created on a flexible substrate that was bent vertically using a jig and fixed in place to create a standard thru.

Particularly, using the developed 3D probing system and the thru standard for the 3D structure, the newly developed 3D probing system successfully measured high-frequency characteristics of two transmission lines up to 110GHz on the two PCBs that were connected using the orthogonal connector (Figure 4).

Primarily, this industry-first development is a result of the “Research and Development Project of the Enhanced Infrastructures for Post 5G Information and Communication Systems” (JPNP 20017). It was commissioned by the New Energy and Industrial Technology Development Organization (NEDO).

Notes

1. Y. Sakuraba et al., “A 110-GHz Probing System for S-parameter Measurements of Three-Dimensional Objects,” European Microwave Conference 2024 (EuMC 2024), EuMC46-4

Images used in this press release come from this thesis.

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-27 September 2024-