Korean automotive supplier Hyundai Mobis and U.S. chip company Qualcomm Technologies Inc. will co-develop next-generation solutions for software-defined vehicle (SDV) and advanced driver-assistance systems (ADAS).

The two companies formally signed the agreement Wednesday (Las Vegas, United States) at Hyundai Mobis’ booth at CES 2026. Jung Soo-Kyung, Executive Vice President and Head of Automotive Electronics Business Unit of Hyundai Mobis, and Nakul Duggal, EVP and Industrial and Group General Manager of Automotive, Industrial and Embedded IoT, and Robotics at Qualcomm Technologies signed the agreement.

Broader SDV Solutions, Beyond ADAS

Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets and pursue global supply opportunities. Hyundai Mobis’ core strength lies in system integration, sensor fusion, and perception while Qualcomm Technologies maintains industry leadership in system-on-chip (SoC) technology.

The companies will begin their work with their co-development of advanced driving and parking solutions based on the Snapdragon Ride Flex (SoC).

These innovations will target fast-growing markets such as India, where ADAS adoption is expanding across vehicle segments alongside rising demand for SDV-ready architectures. For future SDV applications, they will also work together on next-generation integrated solutions that combine Hyundai Mobis’s standardized software platform with Qualcomm Technologies’ Snapdragon automotive technologies to enhance performance, efficiency, and stability.

08 January 2026