Yamaha Robotics Europe has introduced the YRi-V HS optical inspection (AOI) system. Specifically, it comes with enhanced features for faster performance at high resolution and greater accuracy inspecting surface-mounted LEDs.
Yamaha’s YRi-V HS comes with faster high-resolution inspection and adds advanced laser profiling for LED coplanarity. The new system will make way to Yamaha’s booth 462 in Hall A3 at electronica 2024 in Munich, Germany.

Greater Accuracy Inspection

The new YRi-V HS configuration is for electronic manufacturers in all market sectors, from consumer to industrial and automotive. Most importantly, to those seeking greater inspection resolution with high production throughput.
As circuit designers increasingly adopt components with tiny feature sizes, to deliver extra functionality and comply with tough constraints on the overall form factor. Thus, manufacturers need inspection systems with greater resolution to ensure proper quality control. On the other hand, maintaining high throughput is critical to fulfil productivity targets.

Yamaha Robotics Europe has introduced the YRi-V HS optical inspection (AOI) system with enhanced features for faster performance at high resolution and greater accuracy inspecting surface-mounted LEDs.
The new YRi-V HS configuration is for electronic manufacturers in all market sectors, from consumer to industrial and automotive, seeking greater inspection resolution with high production throughput. As circuit designers increasingly adopt components with tiny feature sizes, to deliver extra functionality and comply with tough constraints on the overall form factor, manufacturers need inspection systems with greater resolution to ensure proper quality control. On the other hand, maintaining high throughput is critical to fulfil productivity targets.

Market Background and Product Outline

The reliability shown with SMT processes directly affects the market value of the products. The SMT field in recent years has seen the shift toward smaller sizes, higher densities, greater functionality, and more diversifications accelerate rapidly, and faster yet more precise inspection across all items via AOI will be even more sought after.
Recently, the use of thin and extremely small WLCSPs and FOWLPs, which have specular gloss on the package surface, has risen significantly. Thus, in addition to specular components that are difficult to inspect, the need for compatibility to mount ultra-small chips at narrow pitch is dramatically increasing.
04 November 2024