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ENABLING TECHNOLOGIES
Hybrid bonding
Insulating Resin
Semiconductor Packaging
Toray
Toray Develops New Insulating Resin for Hybrid Bonding
2024-03-21
controller
MCU
motor
Toshiba
Toshiba Adds New Technology to Motor Software Kit
2024-03-20
HItachi iQ
Hitachi Vantara
Industrial AI
NVIDIA
Hitachi Vantara Partners with NVIDIA for New Industrial AI Solutions
2024-03-20
Digital Twin
Generative AI
NVIDIA
Siemens
Siemens, NVIDIA Boost Gen AI in New Collaboration
2024-03-20
18nm
MCU
Samsung Foundry
STMicroelectronics
ST’s New 20nm Breaks Barrier for Advanced MCUs
2024-03-20
NXP, NVIDIA Partner to Accelerate Growth of AI
2024-03-19
Condition Monitoring
Predictive Maintenance
Rockwell Automation
Rockwell’s New Tool Advances Machine Monitoring
2024-03-19
AGV
AMR
Automation
Digital Twin
Robots
Siemens
Siemens Sets New Standard in Supply Chain Automation
2024-03-19
Panasonic Connect
Rapyuta Robotics
supply chain
Warehouse solutions
Panasonic Connect, Rapyuta Robotics Boost Supply Chain Efficiency
2024-03-19
AI
assembly
Automation
TRUMPF
TRUMPF Reinforces Design Process, Taps Power of AI
2024-03-19
AIST
Fujitsu
NICT
NTT
Osaka University
Quantum computing
RIKEN
Japan-Made Quantum Platform Wins Prime Minister Award
2024-03-18
3D Printer
Additive Manufacturing
FPM-Trinity 3D Printer
FUJI
FUJI’s New 3D Printer Accelerates Development Process
2024-03-18
Automotives
Industrial
Micronas
Sensors
TDK
TDK Presents New Dual-Die Stray-Field 3D Position Sensor
2024-03-15
digital manufacturing
factory automation
Mitsubishi Electric
Nozomi Networks
OT-IT
Mitsubishi Boosts Security in New Nozomi Networks Deal
2024-03-15
2nm
AGC
EUV
EUVs
Semiconductor
Semiconductor Packaging
AGC Gears up for IC Glass Substrate Making
2024-03-14
Connector
Electronic Components
SMK
SMK’s New Car Ethernet Connector Has Smallest Width
2024-03-14
DC Power Supply
Decarbonization
NF
NF Chiyoda Electronics
NF Chiyoda Electronics Puts Decarbonization at Core of Business
2024-03-14
AuRoFUSE paste
Bonding technology
Tanaka Kikinzoku
New TANAKA Gold Bonding Material Suits High-Density Chip Mounting
2024-03-14
Automotive components
Hybrid Capacitor
Panasonic Industry
Panasonic Industry New Hybrid Capacitors Work in 135°C
2024-03-08
Automotive component
Inductors
TDK
TDK Launches New Inductors for Automotive High-frequency Circuits
2024-03-08
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