ARM Unveils Two Subsystem Solutions for IoT Edge Device Markets  

Intel Marks Opening of US$3 Billion Factory Expansion

Intel Eyes €33B to Fund New Fab, R&D in Europe

Siemens, UMC Collaboration Yields Proven Design Kits

Hyundai, IonQ Ally to Harness Quantum Computing for Research into EV Battery Chemistry

IBM, Samsung Alliance Bares New Semiconductor Design

Japan Digs Deep in Advanced IC Manufacturing

TSMC, Sony Partner in New IC Fab Joint Venture

Samsung Blazes Trail to in-Memory Neuromorphic ICs

IC Process Takes New Heights in Platform Team up

Korean Makers Make Up About 30% of Apple iPhone 13 Series BOM Costs

Infineon’s New Facility Heightens Chip Capacity Boost

New Technologies Boost Chip Design, Integration

Intel Bets Big on Automotive Chip Market

Setting up a beach head in Europe to enter in automotive chip market

Samsung Unveils Two Breakthrough CMOS Technologies -200MP and All-directional AF

Cree, ST SiC Wafer Supply Deal Reach New Heights

Xilinx, Motovis Ally to Out Smart Front-end Camera System for ADAS

Samsung Blazes Trail to Memory-Centric Chip Solutions

Nepes Joins Hands with Siemens to Automate FO WLP Chip Packaging Process

Foxconn to Buy Macronix’s 6-inch Fab, Enters Wide Band Gap ICs