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Microchip’s New Power Module to Boost Edge AI
2025-04-25
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TSMC, MediaTek Eye Innovative Wireless Connectivity
2025-03-17
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OKI Tech to Surge New Ultracompact Photonic IC
2024-11-15
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OKI Develops New Ultra-Small Optical IC Chip
2024-10-09
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Mitsubishi to Soar Power ICs from its 12in Wafer Line
2024-10-01
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NXP Chip to Offer Better Autonomy in Industrial, IoT
2024-09-11
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NEO to Boost HBM Performance with New 3D X-AI Chip
2024-08-06
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Intel Grit in AI to Offer Better Results in Production
2024-07-03
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EVs Get High Efficiency With Intel’s New SoCs
2024-06-13
Asahi Kasei
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Asahi Kasei IC to Surge Industry 4.0 to New Heights
2024-06-07
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Japanese Startup Premo Makes Wireless Chip Prototype
2024-06-07
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Renesas
Renesas Launches Low-Power MPU for IoT Edge Devices
2024-01-17
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New eYs3D SoCs Transform Computer Vision for Robotics
2024-01-08
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Renesas’ New 32Bit MCU Enables Multimodal AI
2023-12-26
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Siemens, Intel Partner on Advanced IC Manufacturing
2023-12-05
ST Unveils New Industry 4.0-Ready Edge AI IC
2023-05-15
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Renesas’ New MPU Supports FA, Industrial Application
2023-03-24
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NVIDIA’s New GPUs Realize AI, Industrial Metaverse
2023-03-23
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Renesas’ New Wi-Fi Roadmap to Suit Industrial Needs
2022-11-17
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Smart Factory
New NXP Architecture Improves Factory Productivity
2022-11-15
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