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LATEST NEWS
5G
AI
DX
AI, 5G, DX to Drive Japan’s IT Industry
2021-12-16
SK hynix Starts Sample Shipments of 24Gb DDR5 DRAM – Highest Density Ever-
2021-12-15
IBM
Samsung
Semiconductor
semiconductor manufacturing
IBM, Samsung Alliance Bares New Semiconductor Design
2021-12-15
SEMI
Semiconductor
semiconductor manufacturing
IC Equipment Sales to Top Breakthrough US$100B Mark
2021-12-15
AI
AIST
factory automation
Mitsubishi Electric
AI Technology Controls FA Equipment in Real Time
2021-12-15
LG Energy Solution
Siemens
LG Energy Solution, Siemens Ally to Digitalize Battery Production Process
2021-12-14
3D camera
industrial machine vision
MotionCam 3D
Photoneo
New Automation Solution for Parcels Taps 3D Camera
2021-12-14
ABB
Automated Mobile Robots
Sevensense
ABB Partners with Sevensense on Next-Gen AMRs
2021-12-14
Rigaku
X-ray Diffractometer
X-Ray Diffractometer Eyes Quality Control
2021-12-13
Nomura Research Institute
semiconductor manufacturing
SMT
New Technology Lifts Japan Superiority in IC Process
2021-12-13
Nippon Thompson
Nippon Thompson Lays Down Medium-Term Goals
2021-12-13
Digital Twin
Siemens
smart building
Siemens Boosts Digital Twin Ability in New Deal
2021-12-10
Semiconductor Encapsulation Material
Sumitomo Bakelite
Taiwan
Sumitomo Bakelite Builds up Capacity of Taiwan Plant
2021-12-10
Toshiba’s AI Boosts Machine’s Predictive Maintenance
2021-12-10
IoT
OMNIedge
THK
THK’s OMNIedge Caters Taiwan, Singapore Factories
2021-12-09
Fan-out Wafer-Level Packaging
FOPLP
FOWLP
Nepes
Nepes Laweh
Nepes Starts Mass-Production of FOPLP Chip-Packaging Line
2021-12-09
Carbon-Neutral Society
Renewable
Solar Cell
Toshiba
Toshiba’s Photovoltaic Module Tops Record Efficiency
2021-12-09
Capacitors
Nippon Chemi-con
power supply
New Module Guards Equipment from Power Losses
2021-12-08
Han Jong Hee
JY Lee
Samsung Electronics
“New Samsung” Era Begins with Top Management Reshuffle
2021-12-07
Amotech
MLCCs
PME type MLCC
Amotech to Supply MLCCs for ZTE of China
2021-12-07
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