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ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

Power Semiconductor

Mitsubishi Electric Eyes New Wafer Plant
2023-03-15

Toshiba’s New Discrete IGBT Lifts Equipment Efficiency
2023-03-13

Toshiba Eyes New Facility to Expand Power IC Capacity
2022-12-20

STMicroelectronics Boosts SiC in New Italian Facility
2022-10-06

Ancora Boosts GaN Clout, Gets New Investments
2022-09-15

Breakthrough Research Improves SiC Power ICs
2022-09-14

SiC, GaN Lead Race in Wide-Gap Semiconductor Power Devices
2022-09-14

Intel, MediaTek Form New Partnership
2022-07-26

ST, GF Eye FD-SOI Milestones in New 300MM Facility
2022-07-15

Hybrid Capacitor Makers Lift Production on High Automobile Demand
2022-06-22

Hon Hai, YAGEO Invest in MOSFET Leader Thru XSemi
2022-05-26

Unique GaN Power Device to Lower Carbon Emissions
2022-05-16

Mitsubishi Electric to Ship Samples of High Power IGBT Module
2022-04-26

Unique Material Poises for Next-Generation Power ICs
2022-04-25

SDK Brings 6-inch SiC Single Crystal Wafers to Mass Production
2022-04-01

Toshiba to Double Power IC Output in Planned 300mm Fab
2022-02-04

New Technology Takes Chip Bonding to Next Level
2022-02-04

USI to Mass Produce Power Modules for EV Inverters
2022-01-18

Novel Crystal Creates First Ampere-Class SBD
2022-01-05

Full-SiC Module Offers Lower Switching Loss
2022-01-05