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ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

Power Semiconductor

Mitsubishi’s New SiC Die to Surge More Superior xEVs
2024-11-12
ROHM

ROHM Sets Sights on Power Field with New Controller IC
2024-08-21

Toshiba Pushes New Power ICs to Reshape Key Industries
2024-08-14

Infineon to Offer Better MCUs With Innovative Features
2024-08-07

onsemi to Offer the Best SiC to Soar Energy Efficiency
2024-07-19

Shindengen Addresses Noise in New SiC Power Module
2024-07-15
Sumitomo Bakelite

Sumitomo Bakelite’s New Resin Suits SiC Power Modules
2024-07-05

ST, Geely Gear up for Better BEVs in Latest Deal
2024-06-19
SK Keyfoundry

SK keyfoundry to Dive Deep in GaN Power ICs
2024-06-19

Asahi Kasei Secures EV with New eFuse System
2024-06-04

ST to Build New High Volume SiC Site in Italy
2024-05-31

X-FAB, Soitec Team up to Offer Better Power Devices
2024-05-28

Toshiba to Boost Power IC Grit With New 300mm Fab
2024-05-24
SK Keyfoundry

SK keyfoundry Drives Car Power ICs with New BCD Process
2024-04-25

Energy Systems to Gain More from Infineon Power ICs
2024-04-23

ST to Secure More SiCs in New Deal With ROHM
2024-04-22

NGK to More Than Double Substrates Churn for Power IC
2024-03-22
Power IC

USI Rolls New Power Module for xEV Traction Inverters
2024-03-21

ROHM EcoGaN Makes Power-Efficient C4 Duo USB Charger
2024-03-06

Toshiba Releases New Power MOSFETS for Power Supplies
2024-02-23