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News Front

DECEMBER 2016

SPECIAL REPORT:
*
Latest Devices, Mounters Take Cue from Automotives
* Emerging Fields Steer Demand for PWB Products
* Smartphone, IoT Fuel Innovation of High-Speed FPCs
* Device Embedded Technique Floats as New Packaging Option
*

TECHNOLOGY FOCUS:
*
Electronics Assembly Redefi nes Industry Platform
* ADAS Sits at Core of Automotive-Use PCB Development
* EDLCs Evolve to Target High-Temperature Applications
* Magnetic Resonance Exhibits Higher Efficiency in WPT System
* Sub-GHz Wireless Communication Props up IoT Market
* Price-Savvy Market Prompts Smartphone Display Shake up

* NTC Thermistors Make for Optimal Heat Dissipation Control


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mailto Mail: circulationmanila@dempa.co.jp Updated:
December 5, 2016
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