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Semiconductor

Samsung’s Ramp-up to 3D GAA Logic Chip Gains Speed on Lam Research’s Breakthrough Tools
2022-02-12

Lasertec Sees Fresh Market Opportunities in Rapid Adoption of EUV Equipment
2022-02-10

Semicon Korea 2022 Is Back Into Scene With Bullish Prospect for Another Stellar Year
2022-02-09

Intel Turns Up Heats in Competition for Foundry Chip Service Market
2022-02-08

Intel Goes On Spending Spree to Build Mega Fab Hub in Ohio
2022-01-22

Intel Starts to Install Tools at Ireland-based Fab 34
2022-01-21

Samsung Blazes Trail to MRAM-based In-Memory Computing
2022-01-13

SKT to Unveil NPU-based AI Chip at CES2022
2022-01-03

SK hynix Gains Foothold in Enterprise SSD Market
2022-01-03

Lock-down of Xian City Begins to Affect Samsung’s Fab Operation
2021-12-31

Countries Join Onshore Fab Build-up Frenzy for Stable Supply
2021-12-30

NXP, Foxconn Ally to Create “Computing Devices on Wheel’
2021-12-18

NXP scores design wins of RF solutions with Samsung Flip 3 phones
2021-12-18

Hailo, NXP Partner in AI Solution for Vehicle Chips
2021-12-17

Samsung Speeds Up Foray into Automotive Chip Market
2021-12-17

SK hynix Starts Sample Shipments of 24Gb DDR5 DRAM – Highest Density Ever-
2021-12-15

Nepes Starts Mass-Production of FOPLP Chip-Packaging Line
2021-12-09

“New Samsung” Era Begins with Top Management Reshuffle
2021-12-07

Amotech to Supply MLCCs for ZTE of China
2021-12-07

LX Semicon to Make Foray into Automotive Chip Market
2021-12-06