Resonac | AEI

ASIA ELECTRONICS INDUSTRYYOUR WINDOW TO SMART MANUFACTURING

Resonac

Resonac, Soitec to Soar Power ICs With Better Material

2024-09-27

Resonac Develops New Temporary Bonding Film

2024-09-20

Resonac to Soar High With New SiC Line in Japan

2024-09-13

Resonac to Boost Innovative Tech for Best IC Materials

2024-08-15

Resonac to Lead New R&D Consortium on Chip Packaging

2024-07-09

New Japanese Facilities Roll for IC Materials

2024-05-06

Resonac Moves to Recycle Wastes from IC Production

2024-04-09

Resonac Accelerates Capacity With New ¥15B Investments

2024-04-04

Resonac Turns to AI for Faster Material Development

2023-12-21

Resonac Eyes New Semiconductor Back End R&D Center

2023-12-15

Resonac, Matmerize Partner on 6G Materials Creation Using AI

2023-09-14

Resonac Automates Material Inspection Using Deep Learning

2023-07-24

Resonac Ramps up Production of Adhesive Film for IC Packaging

2023-04-05

Resonac Develops New Semiconductor Materials for 6G

2023-03-15

Resonac Upgrades SiC Epitaxial Wafers for Power ICs

2023-03-06

Japanese Electronic Material Firms Ramp up Capacities

2023-02-02