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LATEST NEWS

NXP scores design wins of RF solutions with Samsung Flip 3 phones
2021-12-18

New Factory to Reinforce TAIYO YUDEN’s Capacity
2021-12-17

Hailo, NXP Partner in AI Solution for Vehicle Chips
2021-12-17

Samsung Speeds Up Foray into Automotive Chip Market
2021-12-17

Joint Lab to Yield Intelligent Automation Solutions
2021-12-16

New Inspection System Boosts IC Device Processes
2021-12-16

Display Manufacturing Systems Parade at FINETECH Japan
2021-12-16

AI, 5G, DX to Drive Japan’s IT Industry
2021-12-16

SK hynix Starts Sample Shipments of 24Gb DDR5 DRAM – Highest Density Ever-
2021-12-15

IBM, Samsung Alliance Bares New Semiconductor Design
2021-12-15

IC Equipment Sales to Top Breakthrough US$100B Mark
2021-12-15

AI Technology Controls FA Equipment in Real Time
2021-12-15

LG Energy Solution, Siemens Ally to Digitalize Battery Production Process
2021-12-14

New Automation Solution for Parcels Taps 3D Camera
2021-12-14

ABB Partners with Sevensense on Next-Gen AMRs
2021-12-14

X-Ray Diffractometer Eyes Quality Control
2021-12-13

New Technology Lifts Japan Superiority in IC Process
2021-12-13

Nippon Thompson Lays Down Medium-Term Goals
2021-12-13

Siemens Boosts Digital Twin Ability in New Deal
2021-12-10

Sumitomo Bakelite Builds up Capacity of Taiwan Plant
2021-12-10