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LATEST NEWS
Asahi Kasei
PSPI
Semiconductor
Semiconductor materials
Asahi Kasei to Double Material for Chip Production
2025-09-04
JOINT3
R&D
Resonac
Semiconductor Packaging
US-Joint
New Alliance to Boost Next-Gen Chip Packaging
2025-09-04
Actuator
GaN
Humanoid Robots
Infineon
microcontroller
NVIDIA
Sensors
Infineon to Power Humanoid Robots With NVIDIA Tech
2025-09-04
3D inspection
eBeam Metrology System
Kioxia
Nagoya University
Photo electron Soul
semiconductor manufacturing
Alliance to Make New Mark in IC Inspection, Metrology
2025-09-03
3D inspection
Koh Young
metrology
Taiwan
Koh Young to Soar High in Taiwan With New Office
2025-09-02
AI
DRAM
EMC
High-K Epoxy Molding Compound
SK hynix
SK Hynix to Employ New Tech for More Efficient DRAM
2025-09-02
battery modules
Industrial Robots
Maxell
Subaru
Industrial Robot Line Taps Maxell Battery Modules
2025-09-01
2.5D Chip Design
3DIC
5.5D packaging
Semiconductor Packaging
Socionext
Socionext to Lift 3DIC in New Packaging Line
2025-09-01
aerospace
Frencken
manufacturing investments
Mechatronic
Semiconductor
Singapore
Singapore Facility
Singapore’s Frencken to Invest in New Tech Line
2025-08-30
agentic AI
AI
AI Factory
Foxconn
Hitachi
Hyundai
NVIDIA
TSMC
More Players Grow Compute Power With NVIDIA Servers
2025-08-28
AI
Automation
factory automation
IIOT
NexAIoT
NexAIoT’s Latest AI, IIoT Solutions Take Spotlight
2025-08-26
Cobot
collaborative robot
Humanoid Robots
Solomon
Solomon Unveils NVIDIA-Powered Humanoid Robot
2025-08-24
electronics industry
electronics production
PCB
Thailand
Thailand Board of Investment
Thailand to Surge Grit as ASEAN Chip, PCB Hub
2025-08-22
Cirrus Logic
GlobalFoundries
Manufacturing Investment
Semiconductor
Semiconductor Investment
United States
Cirrus Logic, GF to Surge U.S. Chipmaking in New Pact
2025-08-20
AI
Bonding process
crystal film bonding
OKI
photonics
New OKI Tech Allows Optical Devices Mounting on 300mm
2025-08-19
Intel
investments
Japan
Semiconductor Investment
Semiconductors
Softbank
United States
SoftBank to Soar Grit in AI With Intel Investment
2025-08-19
3DIC
AI
FOPLP
heterogeneous chip integration
HPC
Semicon Taiwan
Semiconductor Packaging
SEMICON Taiwan to Track Growth in Chip Packaging
2025-08-15
DISCO
Semiconductor
wafer
Xanadu
Xanadu, DISCO to Surge Wafer Processing in New Alliance
2025-08-14
ASMPT
ASMPT SEMI
chip bonding
ASMPT’s New Tool to Soar Chip Bonding to New High
2025-08-14
Rigaku
Semiconductor Equipment
X-ray Diffractometer
X-ray metrology
Rigaku’s New Solution to Surge Next-Gen Chips
2025-08-12
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