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LATEST NEWS

Malaysia to Soar Japan Pitch With New Investments
2025-06-05

JAE to Soar Grit of Overseas Businesses
2025-06-05

OKI to Boost Photonics Tech With New R&D in Berlin
2025-06-03

TDK to Offer 3-Terminal Filter for Automotive Use
2025-06-03

ASE’s New Chip Package Tech Suits AI, HPC Demands
2025-05-30

TSMC to Propel Europe Grit With New Design Center
2025-05-29

Asahi Kasei’s New Dry Film to Meet Surge in AI Server 
2025-05-29

ST, A*STAR and ULVAC R&D Lab to Hit New Phase
2025-05-27

New Alliance to Boost Material for Battery Tech in EVs
2025-05-27

Singapore’s A*STAR to Make Way for New 200MM SiC R&D
2025-05-27

Aerotech New Systems Lift Drilling to New Heights
2025-05-26

GF, Singapore’s A*Star Seal New Deal on Chip Packaging
2025-05-26

For NXP, Rapid AI Growth to Make More Impact at Edge
2025-05-22

AEI Coverage: Global Tech Players Chart Future of AI at COMPUTEX
2025-05-20

Foxconn Says Humans Remain Crucial Role in AI Era
2025-05-20

MediaTek to Drive Grit in AI With 2nm Chips
2025-05-20

Intel Unveils New GPUs for AI and Workstations
2025-05-20

Qualcomm to Surge AI CPUs in Data Center
2025-05-19

NVIDIA’s NVLink Fusion to Soar AI Infrastructure
2025-05-19

Koh Young’s Novel Tech Soars Inspection to New Heights
2025-05-17