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LATEST NEWS
Higher-power application
SiC Schottky Barrier Diode
Toshiba
Toshiba Drives Power Efficiency in New 1200V SiC SBDs
2024-09-25
Lasertec
SiC power devices
SiC wafer inspection and review system
Lasertec Boosts SiC Wafer Inspection with New System
2024-09-25
Brother Industries
Deburring Center
Die Cast Parts
Parts Machining
Brother’s New Deburring Center Suits Die-Cast Parts
2024-09-25
Micropsi
MIRAI AI robot software
U.S. Manufacturing
Micropsi Makes New Strategic Shift to U.S. Market
2024-09-25
Power Semiconductors
SiC
STMicroelectronics
ST to Lift SiC Power With its Latest Line
2024-09-25
Infineon
Oxford Ionics
Quantum computing
R&D
Partners to Surge Quantum Computer in New Project
2024-09-24
Carbon Neutrality
Festo
Sustainability
Festo to Lift Clean Energy Drive in its Ohio Line
2024-09-24
Canon
i-Line Stepper
Lithography system
New Canon i-Line Stepper Caters to Small Wafers
2024-09-24
Mitsubishi Electric
Optical Engine Chipset
POET Technologies
POET, Mitsubishi Ally on New Optical Engine for AI
2024-09-24
investments
Jabil
photonics
Jabil to Boost Photonics Line in New Investment
2024-09-24
Automotive SSD
Samsung Electronics
V-NAND Technology
Samsung to Support On-Device AI in Cars with New SSD
2024-09-24
Advantech
embedded computing
IIOT
Semiconductor
Advantech to Lift ASEAN Grit With New Singapore Site
2024-09-23
AI Memory Chip
CXL Memory Solution
HMSDK
SK hynix
SK hynix to Boost CXL with New Linux Addition
2024-09-23
Multilayer Perovskite
Nagoya University
New Perovskites Exhibit Unique Ferroelectric Behavior
2024-09-23
bioeconomy
Chitose
NSK
NSK, CHITOSE to Surge Business in New Alliance
2024-09-23
EUV
JSR
Photoresist
R&D
Semiconductor
JSR to Expand its Photoresists With New Korea Line
2024-09-20
Asahi Kasei
EV battery material
Flame-retardant fabric
Asahi Kasei Fuels EV Battery Safety with New Material
2024-09-20
Automotive
Brazil
KOITO
manufacturing investments
Mexico
KOITO to Sustain Grit in Americas With New Expansions
2024-09-20
EDA
Keysight
M&A
Simulation
Synopsys
Keysight to Surge Software Line in New Synopsys Deal
2024-09-20
Chip Packaging Technology
Resonac
Temporary bonding film
Resonac Develops New Temporary Bonding Film
2024-09-20
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