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LATEST NEWS

NXP, VIS To Set Up New JV For 300mm Fab
2024-06-06
Renesas

Renesas Backs India Chip Drive in New Partnership
2024-06-05
DNP

DNP to Promote Vehicle Recycling in New Decorative Film
2024-06-05
Apollo-Intel

Apollo to Acquire Share in Intel Fab 34 for US$11 Billion
2024-06-05

LG Energy, Analog Devices Enter in New Battery Deal
2024-06-05
Rapidus

Rapidus and IBM Advance on 2nm Chiplet Alliance
2024-06-05

Hitachi and Microsoft Eye Breakthrough AI in New Deal
2024-06-05

MediaTek Boosts Grit in AI With Full Tech Suite
2024-06-04

Asahi Kasei Secures EV with New eFuse System
2024-06-04

COMPUTEX 2024 to Soar Computing High in AI Era
2024-06-04

ASML, Imec to Open  New High NA EUV Lithography Lab
2024-06-04

AMD To Tighten Grip in AI With New Chips
2024-06-03

Factories Bank on NVIDIA Tech Workflow for Better DX
2024-06-03

Sumitomo Bakelite New Polymers Cater to Wide Variety of Uses
2024-06-03

CEA-LETI Paves Way for AI-Embedded CMOS Image Sensor
2024-06-03

NVIDIA Boosts Grit in AI, Eyes New Chip Yearly
2024-06-02

Infineon Shows Grit in AI With its Innovative MCUs
2024-05-31

ST to Build New High Volume SiC Site in Italy
2024-05-31

Tech Group Co-Creates New Ozone Monitor for Thin Film Deposition
2024-05-31
CGD-ITRI

GaN Power Device Advances on New Alliance
2024-05-31